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1 Ergebnisse
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Enabling of Fan-Out WLP for more demanding applications by ..:
, In:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
,
Almeida, Rodrigo
;
Barros, Isabel
;
Campos, Jose
... - p. 935-939 , 2014
Link:
https://doi.org/10.1109/ECTC.2014.6897400
RT T1
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
: T1
Enabling of Fan-Out WLP for more demanding applications by introduction of enhanced dielectric material for higher reliability
UL https://suche.suub.uni-bremen.de/peid=ieee-6897400&Exemplar=1&LAN=DE A1 Almeida, Rodrigo A1 Barros, Isabel A1 Campos, Jose A1 Cardoso, Paulo A1 Castro, Jose A1 Henriques, Vitor A1 O'Toole, Eoin A1 Pinho, Nelson YR 2014 SN 0569-5503 SN 2377-5726 K1 Reliability K1 Dielectric materials K1 Dielectrics K1 Stress K1 Curing K1 Polymers SP 935 OP 939 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2014.6897400 DO https://doi.org/10.1109/ECTC.2014.6897400 SF ELIB - SuUB Bremen
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