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1 Ergebnisse
1
Numerical investigation of glass-weave effects on high-spee..:
, In:
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)
,
Tian, Xinxin
;
Zhang, Yao-Jiang
;
Lim, Jane
... - p. 475-479 , 2014
Link:
https://doi.org/10.1109/ISEMC.2014.6899019
RT T1 <cTitle>2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)</cTitle>: T1 <Title>Numerical investigation of glass-weave effects on high-speed interconnects in printed circuit board</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-6899019&Exemplar=1&LAN=DE A1 Tian, Xinxin A1 Zhang, Yao-Jiang A1 Lim, Jane A1 Qiu, Kelvin A1 Brooks, Rick A1 Zhang, Ji A1 Fan, Jun YR 2014 SN 2158-1118 SN 2158-110X K1 Glass K1 Weaving K1 Dielectrics K1 Periodic structures K1 Resonant frequency K1 Laminates K1 Couplings K1 Glass-weave K1 S-parameter K1 resonance K1 printed circuit boards SP 475 OP 479 LK http://dx.doi.org/https://doi.org/10.1109/ISEMC.2014.6899019 DO https://doi.org/10.1109/ISEMC.2014.6899019 SF ELIB - SuUB Bremen
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