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The physics of Cu pillar bump interconnect under electromig..:

, In: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC),
Hsiao, Yu-Hsiang ; Chen, Chien-Fan ; Yang, Ping-Feng... - p. 1-6 , 2014
Link: https://doi.org/10.1109/ESTC.2014.6962759