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Numerical Study of Overheat Fault in Copper Wire Caused by ..:
, In:
2014 7th International Conference on Intelligent Computation Technology and Automation
,
Yang, Wen-Bing
;
Mo, Shan-Jun
;
Liang, Dong
. - p. 400-405 , 2014
Link:
https://doi.org/10.1109/ICICTA.2014.103
RT T1 <cTitle>2014 7th International Conference on Intelligent Computation Technology and Automation</cTitle>: T1 <Title>Numerical Study of Overheat Fault in Copper Wire Caused by Bad Contact Base on Multi-physics Coupling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7003566&Exemplar=1&LAN=DE A1 Yang, Wen-Bing A1 Mo, Shan-Jun A1 Liang, Dong A1 Zhen, Fang-Jie YR 2014 K1 Wires K1 Contacts K1 Copper K1 Surface resistance K1 Temperature distribution K1 Heating K1 Surface cracks K1 Copper wire K1 Bad contact K1 Multi-physics K1 COMSOL Multiphysics SP 400 OP 405 LK http://dx.doi.org/https://doi.org/10.1109/ICICTA.2014.103 DO https://doi.org/10.1109/ICICTA.2014.103 SF ELIB - SuUB Bremen
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