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Reliability of 3D package using wafer level underfill and l..:

, In: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC),
Cadacio, F. ; Beyer, G. ; Beyne, E.... - p. 444-448 , 2014
Link: https://doi.org/10.1109/EPTC.2014.7028355