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Study of intermetallic compound growth and failure mechanis..:

, In: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC),
Jang, You Cheol ; Park, So Yeon ; Kim, Hyoung Dong... - p. 704-708 , 2014
Link: https://doi.org/10.1109/EPTC.2014.7028359