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1 Ergebnisse
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Reliability enhancement of ultra-thin chip assembly module ..:
, In:
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Lee, Chang-Chun
;
Hsieh, Chia-Ping
;
Guo, Yu-Huan
... - p. 321-324 , 2014
Link:
https://doi.org/10.1109/IMPACT.2014.7048387
RT T1
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
: T1
Reliability enhancement of ultra-thin chip assembly module in 3D-ICs integrations by the assistance of molding compounds
UL https://suche.suub.uni-bremen.de/peid=ieee-7048387&Exemplar=1&LAN=DE A1 Lee, Chang-Chun A1 Hsieh, Chia-Ping A1 Guo, Yu-Huan A1 Lin, Yu-Min A1 Zhan, Chau-Jie A1 Chang, Tao-Chih YR 2014 SN 2150-5934 SN 2150-5942 K1 Through-silicon vias K1 Stress K1 Reliability K1 Strain K1 Silicon K1 Packaging SP 321 OP 324 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT.2014.7048387 DO https://doi.org/10.1109/IMPACT.2014.7048387 SF ELIB - SuUB Bremen
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