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A novel noise mitigation deisgn for TSV-to-device coupling ..:

, In: 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems,
Chang, Chang-Pao ; Kang, Ming-Kai ; Huang, Ting-Yi.. - p. 57-60 , 2014
Link: https://doi.org/10.1109/EPEPS.2014.7103593