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1 Ergebnisse
1
Substrate noise coupling isolation using P+ contact array a..:
, In:
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems
,
Wu, Jia-Yi
;
Zhang, Mu-Shui
;
Tan, Hong-Zhou
. - p. 183-186 , 2014
Link:
https://doi.org/10.1109/EPEPS.2014.7103629
RT T1
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems
: T1
Substrate noise coupling isolation using P+ contact array and grid ground plane in RF/mixed-signal 3D TSV ICs
UL https://suche.suub.uni-bremen.de/peid=ieee-7103629&Exemplar=1&LAN=DE A1 Wu, Jia-Yi A1 Zhang, Mu-Shui A1 Tan, Hong-Zhou A1 Guo, Yong-Xin YR 2014 SN 2165-4107 SN 2165-4115 K1 Noise K1 Substrates K1 Integrated circuit modeling K1 Couplings K1 Through-silicon vias K1 Three-dimensional displays K1 Arrays K1 Noise coupling suppression K1 guard ring K1 3D-IC SP 183 OP 186 LK http://dx.doi.org/https://doi.org/10.1109/EPEPS.2014.7103629 DO https://doi.org/10.1109/EPEPS.2014.7103629 SF ELIB - SuUB Bremen
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