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1 Ergebnisse
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Data pattern based electromagnetic interference modeling fo..:
, In:
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems
,
Huang, Nick K. H.
;
Wang, Tao
;
Jiang, Li Jun
. - p. 227-230 , 2014
Link:
https://doi.org/10.1109/EPEPS.2014.7103640
RT T1 <cTitle>2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems</cTitle>: T1 <Title>Data pattern based electromagnetic interference modeling for IC packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7103640&Exemplar=1&LAN=DE A1 Huang, Nick K. H. A1 Wang, Tao A1 Jiang, Li Jun A1 Xiong, X. Y. YR 2014 SN 2165-4107 SN 2165-4115 K1 Integrated circuit modeling K1 Electromagnetics K1 Integrated circuit packaging K1 Electromagnetic interference K1 Wires K1 Surface reconstruction K1 Surface treatment K1 cavity mode K1 EMI K1 IC packaging K1 EM radiated emission K1 via trace radiation K1 linear superposition SP 227 OP 230 LK http://dx.doi.org/https://doi.org/10.1109/EPEPS.2014.7103640 DO https://doi.org/10.1109/EPEPS.2014.7103640 SF ELIB - SuUB Bremen
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