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1 Ergebnisse
1
Fabrication of arrays of (100) Cu under-bump-metallization ..:
, In:
2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
,
Chiu, Wei-Lan
;
Lu, Chia-Ling
;
Lin, Han-Wen
... - p. 518-522 , 2015
Link:
https://doi.org/10.1109/ICEP-IAAC.2015.7111069
RT T1 <cTitle>2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)</cTitle>: T1 <Title>Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7111069&Exemplar=1&LAN=DE A1 Chiu, Wei-Lan A1 Lu, Chia-Ling A1 Lin, Han-Wen A1 Liu, Chien-Min A1 Huang, Yi-Sa A1 Lu, Tien-Lin A1 Liu, Tao-Chi A1 Hsiao, Hsiang-Yao A1 Chen, Chih A1 Kuo, Jui-Chao A1 Tu, King-Ning YR 2015 K1 Films K1 Annealing K1 X-ray diffraction K1 Grain size K1 Strain K1 Copper K1 -oriented Cu K1 nanotwinned copper K1 abnormal grain growth SP 518 OP 522 LK http://dx.doi.org/https://doi.org/10.1109/ICEP-IAAC.2015.7111069 DO https://doi.org/10.1109/ICEP-IAAC.2015.7111069 SF ELIB - SuUB Bremen
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