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Stencil printing of underfill for flip chips on organic-pan..:

, In: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC),
Lau, John H. ; Zhang, Qinglong ; Li, Ming... - p. 168-174 , 2015
Link: https://doi.org/10.1109/ECTC.2015.7159587