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1 Ergebnisse
1
Effects of thermo-compression bonding parameters on joint f..:
, In:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
,
Shin, Ji-Won
;
Kim, Young Soon
;
Lee, Hyoung Gi
... - p. 910-915 , 2015
Link:
https://doi.org/10.1109/ECTC.2015.7159702
RT T1 <cTitle>2015 IEEE 65th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Effects of thermo-compression bonding parameters on joint formation of micro-bumps in non-conductive film (NCF)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7159702&Exemplar=1&LAN=DE A1 Shin, Ji-Won A1 Kim, Young Soon A1 Lee, Hyoung Gi A1 Kang, Un Byung A1 Seo, Sun Kyung A1 Paik, Kyung-Wook YR 2015 SN 0569-5503 SN 2377-5726 K1 Heating K1 Bonding K1 Viscosity K1 Mathematical model K1 Resins K1 Size measurement K1 Joints SP 910 OP 915 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2015.7159702 DO https://doi.org/10.1109/ECTC.2015.7159702 SF ELIB - SuUB Bremen
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