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Fan-out technologies for WiFi SiP module packaging and elec..:

, In: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC),
Hsieh, Chueh An ; Tsai, Chung Hsuan ; Lee, Huan Wun.. - p. 1664-1669 , 2015
Link: https://doi.org/10.1109/ECTC.2015.7159820