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Fracture mechanism analysis for stealth dicing applied in w..:

, In: 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP),
Chuang, Wan-Chun ; Tu, Wei-Hsiang ; Lin, Guan-shian.. - p. 1-4 , 2015
Link: https://doi.org/10.1109/DTIP.2015.7161040