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1 Ergebnisse
1
Study of surface metallization on 3D flexible stack package:
, In:
2015 16th International Conference on Electronic Packaging Technology (ICEPT)
,
Zheng, Zhen
;
Han, Ye
;
Rong, An
. - p. 458-461 , 2015
Link:
https://doi.org/10.1109/ICEPT.2015.7236626
RT T1
2015 16th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Study of surface metallization on 3D flexible stack package
UL https://suche.suub.uni-bremen.de/peid=ieee-7236626&Exemplar=1&LAN=DE A1 Zheng, Zhen A1 Han, Ye A1 Rong, An A1 Wang, Chunqing YR 2015 K1 Plating K1 Surface treatment K1 Three-dimensional displays K1 Rough surfaces K1 Surface roughness K1 Surface morphology K1 Gold K1 3D package K1 ENIG K1 roughness K1 plating layer thickness SP 458 OP 461 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2015.7236626 DO https://doi.org/10.1109/ICEPT.2015.7236626 SF ELIB - SuUB Bremen
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