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1 Ergebnisse
1
Influence of properties and microstructures on thermal fati..:
, In:
2015 16th International Conference on Electronic Packaging Technology (ICEPT)
,
Chen, Jibing
;
Wan, Nong
;
Li, Juying
... - p. 618-621 , 2015
Link:
https://doi.org/10.1109/ICEPT.2015.7236662
RT T1 <cTitle>2015 16th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Influence of properties and microstructures on thermal fatigue testing of high-power LED</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7236662&Exemplar=1&LAN=DE A1 Chen, Jibing A1 Wan, Nong A1 Li, Juying A1 He, Zhanwen A1 Yin, Yanfang A1 Wu, Yiping YR 2015 K1 Reliability K1 Microstructure K1 Heating K1 Light emitting diodes K1 Optical sensors K1 Welding K1 Algorithm design and analysis K1 High-power LED K1 Property K1 Thermal Fatigue Testing SP 618 OP 621 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2015.7236662 DO https://doi.org/10.1109/ICEPT.2015.7236662 SF ELIB - SuUB Bremen
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