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1 Ergebnisse
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Effect of electroplating parameter on the TSV-Cu protrusion..:
, In:
2015 16th International Conference on Electronic Packaging Technology (ICEPT)
,
Chen, Si
;
Qin, Fei
;
Wang, Ruiming
.. - p. 875-878 , 2015
Link:
https://doi.org/10.1109/ICEPT.2015.7236719
RT T1
2015 16th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Effect of electroplating parameter on the TSV-Cu protrusion during annealing and thermal cycling
UL https://suche.suub.uni-bremen.de/peid=ieee-7236719&Exemplar=1&LAN=DE A1 Chen, Si A1 Qin, Fei A1 Wang, Ruiming A1 An, Tong A1 Yu, Huiping YR 2015 K1 Annealing K1 Additives K1 Silicon K1 Filling K1 Through-silicon vias K1 Reliability K1 Through Silicon Vias (TSV) K1 electroplating filling K1 Cu protrusion K1 annealing K1 thermal cycling SP 875 OP 878 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2015.7236719 DO https://doi.org/10.1109/ICEPT.2015.7236719 SF ELIB - SuUB Bremen
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