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1
Degradation mechanisms of solder joints on printed circuit ..:
, In:
2015 16th International Conference on Electronic Packaging Technology (ICEPT)
,
Kong, Lingchao
;
Zheng, Zhen
;
An, Rong
... - p. 911-914 , 2015
Link:
https://doi.org/10.1109/ICEPT.2015.7236727
RT T1 <cTitle>2015 16th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Degradation mechanisms of solder joints on printed circuit boards during storage determined by infrared multi-point temperature measurements</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7236727&Exemplar=1&LAN=DE A1 Kong, Lingchao A1 Zheng, Zhen A1 An, Rong A1 Li, Hailong A1 Fu, Mingliang A1 Tian, Yanhong A1 Wang, Chunqing A1 An, Rong A1 Wang, Chunqing YR 2015 K1 Temperature measurement K1 Gold K1 Reliability K1 solder joints K1 accelerated storage K1 degradation mechanism K1 infrared measurements SP 911 OP 914 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2015.7236727 DO https://doi.org/10.1109/ICEPT.2015.7236727 SF ELIB - SuUB Bremen
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