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1 Ergebnisse
1
Electrical simulation of gold bonding wire with different p..:
, In:
2015 16th International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Dejing
;
Zhao, Yuanfu
;
Yao, Quanbin
... - p. 1329-1333 , 2015
Link:
https://doi.org/10.1109/ICEPT.2015.7236824
RT T1 <cTitle>2015 16th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Electrical simulation of gold bonding wire with different parameters</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7236824&Exemplar=1&LAN=DE A1 Wang, Dejing A1 Zhao, Yuanfu A1 Yao, Quanbin A1 Cao, Yusheng A1 Lian, Binhao A1 Zhang, Hongshuo YR 2015 K1 Bonding K1 Wires K1 Gold K1 Insertion loss K1 Inductance K1 Resistance K1 Integrated circuit modeling K1 gold bonding wire K1 electrical simulation K1 shape K1 diameter K1 arch height K1 span SP 1329 OP 1333 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2015.7236824 DO https://doi.org/10.1109/ICEPT.2015.7236824 SF ELIB - SuUB Bremen
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