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The electrical characterizations of glass interposer for in..:
, In:
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
,
Lee, Ching-Kuan
;
Wang, Jen-Chun
;
Lin, Yu-Min
... - p. 336-339 , 2015
Link:
https://doi.org/10.1109/IMPACT.2015.7365220
RT T1 <cTitle>2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</cTitle>: T1 <Title>The electrical characterizations of glass interposer for integrated reliability test</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7365220&Exemplar=1&LAN=DE A1 Lee, Ching-Kuan A1 Wang, Jen-Chun A1 Lin, Yu-Min A1 Zhan, Chau-Jie A1 Shen, Wen-Wei A1 Fu, Huan-Chun A1 Lee, Yuan-Chang A1 Chiang, Chia-Wen A1 Chung, Su-Ching A1 Chen, Su-Mei A1 Fan, Chia-Wen A1 Lo, Wei-Chung A1 Lu, Yung Jean YR 2015 K1 Glass K1 Substrates K1 Silicon K1 Assembly K1 Passivation K1 Bonding K1 Polymers SP 336 OP 339 LK http://dx.doi.org/https://doi.org/10.1109/IMPACT.2015.7365220 DO https://doi.org/10.1109/IMPACT.2015.7365220 SF ELIB - SuUB Bremen
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