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A new Class-H thermally stable casting resin for large mold:
, In:
1977 EIC 13th Electrical/Electronics Insulation Conference
,
Yokono, H.
;
Numata, S.
;
Kito, M.
- p. 270-272 , 1977
Link:
https://doi.org/10.1109/EIC.1977.7461961
RT T1 <cTitle>1977 EIC 13th Electrical/Electronics Insulation Conference</cTitle>: T1 <Title>A new Class-H thermally stable casting resin for large molds</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7461961&Exemplar=1&LAN=DE A1 Yokono, H. A1 Numata, S. A1 Kito, M. YR 1977 K1 Resins K1 Casting K1 Resistance heating K1 Immune system K1 Temperature K1 Viscosity SP 270 OP 272 LK http://dx.doi.org/https://doi.org/10.1109/EIC.1977.7461961 DO https://doi.org/10.1109/EIC.1977.7461961 SF ELIB - SuUB Bremen
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