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Prediction of multilayer printed wiring board temperatures ..:
, In:
1973 EIC 11th Electrical Insulation Conference
,
Aung, W.
- p. 211-214 , 1973
Link:
https://doi.org/10.1109/EIC.1973.7468689
RT T1 <cTitle>1973 EIC 11th Electrical Insulation Conference</cTitle>: T1 <Title>Prediction of multilayer printed wiring board temperatures during lamination</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7468689&Exemplar=1&LAN=DE A1 Aung, W. YR 1973 K1 Presses K1 Temperature measurement K1 Lamination K1 Thermal resistance K1 Thermal conductivity K1 History K1 Nonhomogeneous media SP 211 OP 214 LK http://dx.doi.org/https://doi.org/10.1109/EIC.1973.7468689 DO https://doi.org/10.1109/EIC.1973.7468689 SF ELIB - SuUB Bremen
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