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A study on the interaction between barrier and plating caus..:
, In:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Ramanathan, Eswar
;
Smith, Frank
;
Fiacco, Antonio
... - p. 79-82 , 2016
Link:
https://doi.org/10.1109/ASMC.2016.7491107
RT T1 <cTitle>2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>A study on the interaction between barrier and plating causing edge stringer defects in 28nm</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7491107&Exemplar=1&LAN=DE A1 Ramanathan, Eswar A1 Smith, Frank A1 Fiacco, Antonio A1 Silvestre, Mary Claire A1 Parks, Val A1 Rajagopalan, Balajee A1 Scott, Hildreth A1 Barker, John A1 Riendeau, Jeffrey A1 Laloe, Jean-Baptiste YR 2016 SN 2376-6697 K1 Plating K1 Copper K1 Films K1 Hardware K1 Inspection K1 Cleaning K1 Adhesives K1 Edge defectivity K1 Copper Plating K1 Barrier seed deposition K1 Copper Strings SP 79 OP 82 LK http://dx.doi.org/https://doi.org/10.1109/ASMC.2016.7491107 DO https://doi.org/10.1109/ASMC.2016.7491107 SF ELIB - SuUB Bremen
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