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Test structures for residual stress monitoring in the integ..:
, In:
2016 13th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)
,
Alvarez, Carlos Ramon Baez
;
Aranda, Monico Linares
;
Jacome, Alfonso Torres
. - p. 1-4 , 2016
Link:
https://doi.org/10.1109/SMACD.2016.7520745
RT T1
2016 13th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)
: T1
Test structures for residual stress monitoring in the integrated CMOS-MEMS process development
UL https://suche.suub.uni-bremen.de/peid=ieee-7520745&Exemplar=1&LAN=DE A1 Alvarez, Carlos Ramon Baez A1 Aranda, Monico Linares A1 Jacome, Alfonso Torres A1 Arriaga, Wilfrido Calleja YR 2016 K1 Artificial intelligence K1 Three-dimensional displays K1 Iron K1 Test Structures K1 microelectromechanical systems (MEMS) integration K1 intra-CMOS K1 finite element simulation SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/SMACD.2016.7520745 DO https://doi.org/10.1109/SMACD.2016.7520745 SF ELIB - SuUB Bremen
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