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1 Ergebnisse
1
3D Stacking Using Bump-Less Process for Sub 10um Pitch Inte..:
, In:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
,
Derakhshandeh, Jaber
;
De Preter, Inge
;
Gerets, Carine
... - p. 128-133 , 2016
Link:
https://doi.org/10.1109/ECTC.2016.377
RT T1 <cTitle>2016 IEEE 66th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7545422&Exemplar=1&LAN=DE A1 Derakhshandeh, Jaber A1 De Preter, Inge A1 Gerets, Carine A1 Hou, Lin A1 Heylen, Nancy A1 Beyne, Eric A1 Beyer, Gerald A1 Slabbekoorn, John A1 Dubey, Vikas A1 Jourdain, Anne A1 Potoms, Goedele A1 Inoue, Fumihiro A1 Jamieson, Geraldine A1 Vandersmissen, Kevin A1 Suhard, Samuel A1 Webers, Tomas A1 Capuz, Giovanni A1 Wang, Teng A1 Rebibis, Kenneth June A1 Miller, Andy YR 2016 K1 Polymers K1 Stacking K1 Bonding K1 Planarization K1 Three-dimensional displays K1 Nickel K1 3DIC K1 microbumps scaling K1 polymer to oxide bonding K1 Sn to Cu bonding SP 128 OP 133 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2016.377 DO https://doi.org/10.1109/ECTC.2016.377 SF ELIB - SuUB Bremen
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