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1 Ergebnisse
1
3Di DC-DC Buck Micro Converter with TSVs, Grind Side Induct..:
, In:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
,
Safran, John
;
Rangan, Giri N. K.
;
Vanukuru, Venkata Nr
... - p. 1451-1456 , 2016
Link:
https://doi.org/10.1109/ECTC.2016.324
RT T1
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
: T1
3Di DC-DC Buck Micro Converter with TSVs, Grind Side Inductors, and Deep Trench Decoupling Capacitors in 32nm SOI CMOS
UL https://suche.suub.uni-bremen.de/peid=ieee-7545614&Exemplar=1&LAN=DE A1 Safran, John A1 Rangan, Giri N. K. A1 Vanukuru, Venkata Nr A1 Torgal, Sandeep A1 Chaturvedi, Vikram A1 Lal K. P, Sarath A1 Butt, Shahid A1 Maier, Gary A1 Cestero, Alberto A1 Tran-Quinn, Thuy A1 Nag, Joyeeta A1 Rosenblatt, Sami A1 Robson, Norman A1 Angyal, Matthew A1 Graves-Abe, Troy A1 Berger, Daniel A1 Pape, James A1 Iyer, Subramanian YR 2016 K1 Inductors K1 Voltage control K1 Through-silicon vias K1 Capacitors K1 Resistance K1 Clocks K1 Three-dimensional displays K1 3D K1 TSV K1 voltage regulators K1 buck converter SP 1451 OP 1456 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2016.324 DO https://doi.org/10.1109/ECTC.2016.324 SF ELIB - SuUB Bremen
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