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1 Ergebnisse
1
Effects of Reflow Cooling Rate on the Growth of Ag3Sn Plate..:
, In:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
,
Lin, Chi Pu
;
Wan, Katch
;
Sun, Tommy
.. - p. 2075-2081 , 2016
Link:
https://doi.org/10.1109/ECTC.2016.38
RT T1
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
: T1
Effects of Reflow Cooling Rate on the Growth of Ag3Sn Platelets and Deformation of Solder Balls
UL https://suche.suub.uni-bremen.de/peid=ieee-7545710&Exemplar=1&LAN=DE A1 Lin, Chi Pu A1 Wan, Katch A1 Sun, Tommy A1 Chen, Chih-Ming A1 Lee, Rick YR 2016 K1 Cooling K1 Morphology K1 Surface morphology K1 Etching K1 Reliability K1 Electronics packaging K1 Ag3Sn K1 cooling rate K1 solidification K1 precipitate K1 deformed solder SP 2075 OP 2081 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2016.38 DO https://doi.org/10.1109/ECTC.2016.38 SF ELIB - SuUB Bremen
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