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1 Ergebnisse
1
Development and Reliability Evaluation of Large Scale Thin ..:
, In:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
,
Bum, Lee Jong
;
Choong, Chong Ser
;
Yuen, Au Keng
. - p. 2089-2094 , 2016
Link:
https://doi.org/10.1109/ECTC.2016.316
RT T1
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
: T1
Development and Reliability Evaluation of Large Scale Thin TSV Die Stacking on Wafer
UL https://suche.suub.uni-bremen.de/peid=ieee-7545712&Exemplar=1&LAN=DE A1 Bum, Lee Jong A1 Choong, Chong Ser A1 Yuen, Au Keng A1 Woo, Rhee Min YR 2016 K1 Bonding K1 Stacking K1 Through-silicon vias K1 Semiconductor device reliability K1 Resistance K1 Curing K1 Fine pitch bump bonding process K1 Large scale integration K1 Through silicon vias K1 reliability test SP 2089 OP 2094 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2016.316 DO https://doi.org/10.1109/ECTC.2016.316 SF ELIB - SuUB Bremen
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