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Imaging of strain from deep trenches using X-Ray Diffractio..:

, In: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Gambino, J. P. ; Watanabe, Y. ; Kanuma, Y.... - p. 321-325 , 2016
Link: https://doi.org/10.1109/IPFA.2016.7564309