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1 Ergebnisse
1
Analysis of solder joint shape parameters on the stress and..:
, In:
2016 17th International Conference on Electronic Packaging Technology (ICEPT)
,
Hua, Jianwei
;
Huang, Chunyue
;
Liang, Ying
.. - p. 455-460 , 2016
Link:
https://doi.org/10.1109/ICEPT.2016.7583175
RT T1 <cTitle>2016 17th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Analysis of solder joint shape parameters on the stress and strain of the solder joint in the random vibration condition</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7583175&Exemplar=1&LAN=DE A1 Hua, Jianwei A1 Huang, Chunyue A1 Liang, Ying A1 Li, Tian-ming A1 Zhang, Long YR 2016 K1 Stress K1 Finite element analysis K1 Optical coupling K1 Analytical models K1 Optical losses K1 Optical arrays K1 optical interconnection technology K1 solder joint array K1 finite element analysis K1 random vibration analysis K1 stress and strain SP 455 OP 460 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2016.7583175 DO https://doi.org/10.1109/ICEPT.2016.7583175 SF ELIB - SuUB Bremen
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