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1 Ergebnisse
1
TSV-Cu protrusion induced by thermal cycling test:
, In:
2016 17th International Conference on Electronic Packaging Technology (ICEPT)
,
Chen, Si
;
Qin, Fei
;
Zhao, Jingyi
. - p. 1095-1098 , 2016
Link:
https://doi.org/10.1109/ICEPT.2016.7583316
RT T1
2016 17th International Conference on Electronic Packaging Technology (ICEPT)
: T1
TSV-Cu protrusion induced by thermal cycling test
UL https://suche.suub.uni-bremen.de/peid=ieee-7583316&Exemplar=1&LAN=DE A1 Chen, Si A1 Qin, Fei A1 Zhao, Jingyi A1 An, Tong YR 2016 K1 Annealing K1 Thermal conductivity K1 Heating K1 Cooling K1 Integrated optics K1 Silicon K1 Three-dimensional displays K1 Through Silicon Via (TSV) K1 electroplating parameter K1 protrusion K1 microstructure K1 thermal cycling SP 1095 OP 1098 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2016.7583316 DO https://doi.org/10.1109/ICEPT.2016.7583316 SF ELIB - SuUB Bremen
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