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Impacts of back-grinding process parameters on the strength..:

, In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT),
Bie, Xiaorui ; Qin, Fei ; Zhou, Linfeng... - p. 1197-1200 , 2016
Link: https://doi.org/10.1109/ICEPT.2016.7583338