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1 Ergebnisse
1
The finite element analysis on reliability of gold bump:
, In:
2016 17th International Conference on Electronic Packaging Technology (ICEPT)
,
Liu, Jiansong
;
Yao, Quanbin
;
Lin, Pengrong
.. - p. 1330-1333 , 2016
Link:
https://doi.org/10.1109/ICEPT.2016.7583369
RT T1
2016 17th International Conference on Electronic Packaging Technology (ICEPT)
: T1
The finite element analysis on reliability of gold bump
UL https://suche.suub.uni-bremen.de/peid=ieee-7583369&Exemplar=1&LAN=DE A1 Liu, Jiansong A1 Yao, Quanbin A1 Lin, Pengrong A1 Cao, Yusheng A1 Lian, Binhao YR 2016 K1 Strain K1 Mathematical model K1 Integrated circuit modeling K1 Predictive models K1 Flip-chip devices K1 Fatigue K1 Thermal loading K1 gold bump K1 thermal cycling K1 stress K1 strain K1 fatigue life SP 1330 OP 1333 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2016.7583369 DO https://doi.org/10.1109/ICEPT.2016.7583369 SF ELIB - SuUB Bremen
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