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Nanocopper as a soldering alternative: Solder-free assembly:

, In: 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO),
Zinn, Alfred A. ; Stoltenberg, Randall M. ; Chang, Jerome.. - p. 367-370 , 2016
Link: https://doi.org/10.1109/NANO.2016.7751572