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1 Ergebnisse
1
Transient light emission microscopy for detecting the non-u..:
, In:
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
,
Tao, Mian
;
Ricky Lee, S.W.
- p. 297-301 , 2017
Link:
https://doi.org/10.1109/SEMI-THERM.2017.7896944
RT T1 <cTitle>2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)</cTitle>: T1 <Title>Transient light emission microscopy for detecting the non-uniform junction temperature in flip-chip light emitting diodes</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7896944&Exemplar=1&LAN=DE A1 Tao, Mian A1 Ricky Lee, S.W. YR 2017 SN 1065-2221 K1 Bonding K1 Light emitting diodes K1 Microscopy K1 Junctions K1 Temperature measurement K1 Semiconductor device measurement K1 Proximity effects K1 Light-emitting diode (LED) K1 junction temperature (Tj) K1 electrical K1 thermal K1 current crowding K1 light intensity SP 297 OP 301 LK http://dx.doi.org/https://doi.org/10.1109/SEMI-THERM.2017.7896944 DO https://doi.org/10.1109/SEMI-THERM.2017.7896944 SF ELIB - SuUB Bremen
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