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1 Ergebnisse
1
Technology advancement of laminate substrates for mobile, i..:
, In:
2017 China Semiconductor Technology International Conference (CSTIC)
,
Lee, Ken
;
Kim, Min Sung
;
Shim, Peter
... - p. 1-4 , 2017
Link:
https://doi.org/10.1109/CSTIC.2017.7919867
RT T1
2017 China Semiconductor Technology International Conference (CSTIC)
: T1
Technology advancement of laminate substrates for mobile, iot, and automotive applications
UL https://suche.suub.uni-bremen.de/peid=ieee-7919867&Exemplar=1&LAN=DE A1 Lee, Ken A1 Kim, Min Sung A1 Shim, Peter A1 Han, Ica A1 Lee, Jack A1 Chun, Jeffery A1 Cha, Samuel YR 2017 K1 Dielectrics K1 Electromagnetic compatibility K1 Thermal conductivity K1 Sensors K1 Process control K1 Substrates K1 Reliability K1 substrate K1 package K1 mobile K1 IoT K1 automotive SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC.2017.7919867 DO https://doi.org/10.1109/CSTIC.2017.7919867 SF ELIB - SuUB Bremen
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