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1 Ergebnisse
1
Electroplating for the Ni probe tip:
, In:
2017 International Conference on Electronics Packaging (ICEP)
,
Kim, Nam Gil
;
Sun, Yong-Bin
- p. 33-34 , 2017
Link:
https://doi.org/10.23919/ICEP.2017.7939319
RT T1 <cTitle>2017 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Electroplating for the Ni probe tip</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7939319&Exemplar=1&LAN=DE A1 Kim, Nam Gil A1 Sun, Yong-Bin YR 2017 K1 Annealing K1 Nickel K1 Nanocrystals K1 Grain size K1 Probes K1 Internal stresses K1 nanocrystal K1 pulsed electroplating K1 over-potential K1 Ni probe tip K1 Ni-P alloy SP 33 OP 34 LK http://dx.doi.org/https://doi.org/10.23919/ICEP.2017.7939319 DO https://doi.org/10.23919/ICEP.2017.7939319 SF ELIB - SuUB Bremen
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