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1 Ergebnisse
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An investigation on ultrathin wafer dicing by ultrafast las..:
, In:
2017 International Conference on Electronics Packaging (ICEP)
,
Wu, Shih-jeh
;
Hsu, Hsiang-Chen
;
Lin, Wen-Fei
. - p. 139-143 , 2017
Link:
https://doi.org/10.23919/ICEP.2017.7939342
RT T1
2017 International Conference on Electronics Packaging (ICEP)
: T1
An investigation on ultrathin wafer dicing by ultrafast laser with high density plasma etching
UL https://suche.suub.uni-bremen.de/peid=ieee-7939342&Exemplar=1&LAN=DE A1 Wu, Shih-jeh A1 Hsu, Hsiang-Chen A1 Lin, Wen-Fei A1 Fu, Shen-Li YR 2017 K1 Iterative closest point algorithm K1 Etching K1 Substrates K1 Plasmas K1 Coatings K1 Laser beam cutting K1 Silicon K1 ICP chamber K1 electron cyclotron resonance plasma K1 ultrafast (pico-second) laser SP 139 OP 143 LK http://dx.doi.org/https://doi.org/10.23919/ICEP.2017.7939342 DO https://doi.org/10.23919/ICEP.2017.7939342 SF ELIB - SuUB Bremen
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