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An investigation on ultrathin wafer dicing by ultrafast las..:

, In: 2017 International Conference on Electronics Packaging (ICEP),
Wu, Shih-jeh ; Hsu, Hsiang-Chen ; Lin, Wen-Fei. - p. 139-143 , 2017
Link: https://doi.org/10.23919/ICEP.2017.7939342