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Effects of Bi in Sn-Cu based lead-free solder alloys and in..:

, In: 2017 International Conference on Electronics Packaging (ICEP),
Nogita, K. ; Mohd Salleh, M.A.A. ; Smith, S.... - p. 377-380 , 2017
Link: https://doi.org/10.23919/ICEP.2017.7939399