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1 Ergebnisse
1
Investigation of defective bonding pad affected by the cont..:
, In:
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Kwon, Soon Seok
;
Hwang, Sung Min
;
Kim, Hyoung Ryeun
... - p. 149-153 , 2017
Link:
https://doi.org/10.1109/ASMC.2017.7969216
RT T1 <cTitle>2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>Investigation of defective bonding pad affected by the contamination of Front Opening Unified Pod (FOUP)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7969216&Exemplar=1&LAN=DE A1 Kwon, Soon Seok A1 Hwang, Sung Min A1 Kim, Hyoung Ryeun A1 Jang, Hee Chang A1 Hong, Jeong Hoon A1 Song, Gil Joo A1 Park, Hyun Yul A1 Kim, Jin Young A1 Noh, Tae Yong A1 Yoo, Seoung-Kyo YR 2017 SN 2376-6697 K1 Ions K1 Bonding K1 Etching K1 Wires K1 Aluminum K1 Surface contamination K1 bonding pad K1 fluoride ion K1 etching process K1 front open unified pod SP 149 OP 153 LK http://dx.doi.org/https://doi.org/10.1109/ASMC.2017.7969216 DO https://doi.org/10.1109/ASMC.2017.7969216 SF ELIB - SuUB Bremen
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