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1
A new sub-micron trench cell concept in ultrathin wafer tec..:
, In:
2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)
,
Jaeger, Christian
;
Philippou, Alexander
;
VeIlei, Antonio
.. - p. 69-72 , 2017
Link:
https://doi.org/10.23919/ISPSD.2017.7988895
RT T1
2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD)
: T1
A new sub-micron trench cell concept in ultrathin wafer technology for next generation 1200 V IGBTs
UL https://suche.suub.uni-bremen.de/peid=ieee-7988895&Exemplar=1&LAN=DE A1 Jaeger, Christian A1 Philippou, Alexander A1 VeIlei, Antonio A1 Laven, Johannes G. A1 Hartl, Andreas YR 2017 SN 1946-0201 K1 micro-pattern trench K1 narrow mesas K1 drives applications SP 69 OP 72 LK http://dx.doi.org/https://doi.org/10.23919/ISPSD.2017.7988895 DO https://doi.org/10.23919/ISPSD.2017.7988895 SF ELIB - SuUB Bremen
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