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1 Ergebnisse
1
Mesh-based lumped parameter model with MOR for thermal anal..:
, In:
2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia (IFEEC 2017 - ECCE Asia)
,
Wenbo Wang
;
Xibo Yuan
;
Evans, Paul L.
. - p. 1037-1042 , 2017
Link:
https://doi.org/10.1109/IFEEC.2017.7992184
RT T1 <cTitle>2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia (IFEEC 2017 - ECCE Asia)</cTitle>: T1 <Title>Mesh-based lumped parameter model with MOR for thermal analysis of virtual prototyping for power electronics systems with comparison to FDM</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7992184&Exemplar=1&LAN=DE A1 Wenbo Wang A1 Xibo Yuan A1 Evans, Paul L. A1 Mellor, Philip H. YR 2017 K1 Heat transfer K1 Frequency division multiplexing K1 Thermal analysis K1 Thermal resistance K1 Power electronics K1 Bars K1 Mesh-based lumped parameter model K1 finite difference method K1 model order reduction K1 thermal analysis K1 virtual prototyping K1 design optimisation K1 power electronics systems SP 1037 OP 1042 LK http://dx.doi.org/https://doi.org/10.1109/IFEEC.2017.7992184 DO https://doi.org/10.1109/IFEEC.2017.7992184 SF ELIB - SuUB Bremen
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