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1 Ergebnisse
1
Passive Devices Fabrication on FOWLP and Characterization f..:
, In:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
,
Wang, Chunmei
;
Chui, King Jien
;
Wang, Xiangyu
... - p. 312-318 , 2017
Link:
https://doi.org/10.1109/ECTC.2017.315
RT T1
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
: T1
Passive Devices Fabrication on FOWLP and Characterization for RF Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-7999709&Exemplar=1&LAN=DE A1 Wang, Chunmei A1 Chui, King Jien A1 Wang, Xiangyu A1 Lim, Teck Guan A1 Yu, Mingbin A1 See, Gilbert A1 Yu, Gu YR 2017 SN 2377-5726 K1 Resistors K1 MIM capacitors K1 Capacitors K1 Wet etching K1 Inductors K1 Testing K1 Passive devices K1 FOWLP SP 312 OP 318 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2017.315 DO https://doi.org/10.1109/ECTC.2017.315 SF ELIB - SuUB Bremen
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