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A Novel Pick-Up and Place Process for FO-WLP Using Tape Exp..:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Takyu, Shinya ; Okamoto, Naoya ; Yamada, Tadatomo.. - p. 364-370 , 2017
Link: https://doi.org/10.1109/ECTC.2017.112