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1 Ergebnisse
1
Process and Reliability of Large Fan-Out Wafer Level Packag..:
, In:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
,
Rao, Vempati Srinivasa
;
Chong, Chai Tai
;
Ho, David
... - p. 615-622 , 2017
Link:
https://doi.org/10.1109/ECTC.2017.122
RT T1 <cTitle>2017 IEEE 67th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-7999753&Exemplar=1&LAN=DE A1 Rao, Vempati Srinivasa A1 Chong, Chai Tai A1 Ho, David A1 Zhi, Ding Mian A1 Choong, Chong Ser A1 P.S., Sharon Lim A1 Ismael, Daniel A1 Liang, Ye Yong YR 2017 SN 2377-5726 K1 Reliability K1 Semiconductor device measurement K1 Lasers K1 Force K1 Fabrication K1 Compounds K1 Layout K1 Fan-Out WLP K1 Package-on-Package K1 Fine pitch RDL K1 Multi-Chip Package K1 Through Mold Interconnections SP 615 OP 622 LK http://dx.doi.org/https://doi.org/10.1109/ECTC.2017.122 DO https://doi.org/10.1109/ECTC.2017.122 SF ELIB - SuUB Bremen
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