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The Comparison of Package Design and Electrical Analysis in..:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Hsieh, Tsun-Lung ; Chou, Yuan-Hsi ; Pan, Po-Chih... - p. 1855-1860 , 2017
Link: https://doi.org/10.1109/ECTC.2017.326