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1 Ergebnisse
1
Impact of substrate surface condition and epoxy mixture pro..:
, In:
2017 18th International Conference on Electronic Packaging Technology (ICEPT)
,
Lou, Xun
;
Yang, Li
;
Zhu, Rui
... - p. 207-211 , 2017
Link:
https://doi.org/10.1109/ICEPT.2017.8046439
RT T1 <cTitle>2017 18th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Impact of substrate surface condition and epoxy mixture properties on the overflow/incomplete flow</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-8046439&Exemplar=1&LAN=DE A1 Lou, Xun A1 Yang, Li A1 Zhu, Rui A1 Wu, Huan A1 Chen, Lei A1 Zhang, Wenfeng A1 Jia, Chong A1 Hwai Peng Yeoh A1 Xu, Junhong YR 2017 K1 Substrates K1 Rough surfaces K1 Surface roughness K1 Viscosity K1 Temperature K1 Surface tension K1 Thermal stability K1 underfill package K1 epoxy fluidness K1 substrate surface conditions SP 207 OP 211 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT.2017.8046439 DO https://doi.org/10.1109/ICEPT.2017.8046439 SF ELIB - SuUB Bremen
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