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Electro-thermal and thermal-mechanical FE analysis of IGBT ..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Zhao, Jingyi ; Qin, Fei ; An, Tong.. - p. 548-551 , 2017
Link: https://doi.org/10.1109/ICEPT.2017.8046514