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Numerical simulation of the wire bonding reliability of IGB..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Bie, Xiaorui ; Qin, Fei ; An, Tong.. - p. 1396-1401 , 2017
Link: https://doi.org/10.1109/ICEPT.2017.8046696